Roger L. Franz
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“Lead: Past, Present and Future.” Electronic Design, Jan. 28, 2020).

“Living Without Halogens and Phthalates:  The Why’s and How’s.  Electronic Design, Dec. 28, 2018. https://www.

“Prospects for Energy on Earth (Fifth Edition, 2018).

“Full Material Declarations: Removing Barriers to Environmental Data Reporting.} SMT007 Magazine, July, 2018.  http:

“Stay Ahead of Regulations with FMDs.”, April 11,2018.  

“Full Material Declarations: Removing Barriers to Environmental Data Reporting,” Electronic Design, Mar. 16, 2018.

“Full Material Declarations:  Removing Barriers to Environmental Data Reporting.”  Presented at 2018 IPC Apex Expo
Technical Conference, San Diego, CA, Feb. 26, 2018.  Available:

“Connecting with the Planets.” Electronic Design, Jan. 23, 2017.  
Online feature article:

“Passive Components Get Active.”
Electronic Design, Dec. 5, 2016.

“How Will We Get the Gallium?” Electronic Design, April 4, 2016.

“Beyond “Lead-Free”: An Update on the IPC-1752A Standard for Materials Declaration.”  Electronic Design, Jan. 8,
Also available from IPC:

“Reverse Logistics is Fundamentally Logical.”  EBN Online, Dec. 17, 2012.

“Status of ULE Draft Standard 102 for Door Leafs.”  Presented to Door & Access Systems Manufacturers Association
(DASMA) International, Chicago, IL, Sept. 27, 2011.  

“Sustainability, Standards and Future Trends.” Presented to International Microelectronics and Packaging Society
(IMAPS), Milwaukee/Chicago Chapter, session on Environmentally Innovative Electronic Concepts, Arlington Heights,
IL, Sept. 20, 2011.  Available:

“Standards and Sustainability.”  Presented to IEEE Product Safety Engineering Society, Chicago Chapter, Aug. 24,

“Making Serious Light of Metals,” UL Lumen Insights, May-June, 2011, p. 3.

“The Life Cycle of Materials in Mobile Phones.”  UL White Paper, June, 2011.

“Negative Differential Resistance Leads to Some Positive Results.”  
Electronic Design, June 29, 2010. http://www.

“Use Nonlinear Devices as Linchpins to Next Generation Design.” Electronic Design, June 23, 2010. https://www.

“Environmental Programs in the Consumer Products Sector.”  Electronics & Sustainability: Design for Energy and the
Environment, Illinois Sustainable Electronics Initiative, University of Illinois at Champaign-Urbana, Feb. 24, 2010.

“Case Studies in RoHS Compliance: Eight Ways to Reach the Goal.”  IPC/JEDEC 11th International Conference on
Lead Free Electronic Components and Assemblies, Boston, MA, Dec. 7, 2005.  Preview:  

“Pulling the Plug on Current Drain:  Advances in Material Selection for Reducing Standby Leakage.”  
IEEE Circuits &
Devices Magazine
, Vol. 20, No. 6, pp. 12-16, November/December, 2004.

“Application of Threshold Switches to Limit Standby Energy Loss,” April 19, 2004.  Preview: http://www.

“Recycling of Small Electronic Products,”
Recycling Today,  June 15, 2004. https://www.recyclingtoday.

“Remove RoHS Colored Glasses and Roll Up Shirtsleeves,”
Semiconductor International, April, 1, 2003, p. 34.  Co-
published in
Electronic Packaging and Production, v.43, no.4, April 1, 2003.  

“Optimizing Portable Product Recycling Through Reverse Supply Chain Technology,” IEEE International Symposium
on Electronics and the Environment, May 6-9, 2002, San Francisco, CA, pp. 274-279.

“Recycling Portable Electronics,” presented in teleconference to Design for Environment Panel, The Electronics
Product Recovery and Recycling (EPR2) Conference and The Electronics Recycling Summit, Arlington, VA, April 17-
19, 2001.

With M. Stutz, I. Nicolaescu, U. Wagner and P. Tzscheutschler, “Energy Use in the Life Cycle of Cellular Phones: A
study of the impacts during manufacturing and use.” Joint International Congress and Exhibition, Electronics Goes
Green 2000+, September 11-13, 2000, ESTREL Congress Center, Berlin, Germany.

With M. Stutz and M. Zurkirch.  “Environmentally Preferred Phone:  A Joint Pilot with Swisscom.” European Telecom
Network (ETNO) Conference, Ipswich, UK, Nov., 2000.

“The Use of Failure Analysis as a Preventative Quality Tool.”  Presented at ASM Materials Week ’92, Chicago, IL, Nov.
2, 1992, and published in Journal of Materials Engineering and Performance, Vol. 2, No. 6, pp.793-797 (Dec., 1993).

“Case Studies in Early Component Analysis for Improved Reliability.” Guest speaker, Illiana Section ASQC meeting,
Sept, 15, 1992.

“Failure Analysis in Today’s Quality System.”  in Transactions of the 46th Annual Quality Congress, May 18-20, 1992,
Nashville, TN, pp. 869-875 (Milwaukee, WI:  American Society for Quality Control, 1992).

With C. Bloomer, M. Johnson, S. Kent, B. Mepham, S. Smith, and L. Walker, “Failure Mechanisms in Through-Hole
Packages.”  Electronic Materials Handbook: Packaging, Volume 1, pp. 969-981 (Metals Park, OH:  ASM International,

“Evaluate Products and Packaging with Drop Tests.”  
Evaluation Engineering, Oct., 1983, pp. 56-57.

“Continuous Flow Analysis of Cholesterol Digitonide.”  
Clinical Chemistry, April, 1978, pp. 725-726.  http://clinchem.

“Educators' vital role.” (Letters)  
Environ. Sci. Technol., 1969, 3 (6), pp 508–510
The elements of a Renaissance man are
“…art, science, music, invention, and writing.”
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