“Status of ULE Draft Standard 102 for Door Leafs.” Presented to Door & Access Systems Manufacturers Association (DASMA) International, Chicago, IL, Sept. 27, 2011.
“Sustainability, Standards and Future Trends.” Presented to International Microelectronics and Packaging Society (IMAPS), Milwaukee/Chicago Chapter, session on Environmentally Innovative Electronic Concepts, Arlington Heights, IL, Sept. 20, 2011. Available: https://www.slideshare.net/RogerLFranz/sustainability-and-standards-presented-at-imaps- sep-20-2011
“Standards and Sustainability.” Presented to IEEE Product Safety Engineering Society, Chicago Chapter, Aug. 24, 2011.
“Making Serious Light of Metals,” UL Lumen Insights, May-June, 2011, p. 3.
“The Life Cycle of Materials in Mobile Phones.” UL White Paper, June, 2011.
“Environmental Programs in the Consumer Products Sector.” Electronics & Sustainability: Design for Energy and the Environment, Illinois Sustainable Electronics Initiative, University of Illinois at Champaign-Urbana, Feb. 24, 2010.
“Case Studies in RoHS Compliance: Eight Ways to Reach the Goal.” IPC/JEDEC 11th International Conference on Lead Free Electronic Components and Assemblies, Boston, MA, Dec. 7, 2005. Preview: https://priorart.ip. com/IPCOM/000141384/
“Pulling the Plug on Current Drain: Advances in Material Selection for Reducing Standby Leakage.” IEEE Circuits & Devices Magazine, Vol. 20, No. 6, pp. 12-16, November/December, 2004. https://ieeexplore.ieee.org/document/1364770
“Application of Threshold Switches to Limit Standby Energy Loss,” April 19, 2004. Preview: http://www. priorartdatabase.com/IPCOM/000028020/
“Remove RoHS Colored Glasses and Roll Up Shirtsleeves,” Semiconductor International, April, 1, 2003, p. 34. Co- published in Electronic Packaging and Production, v.43, no.4, April 1, 2003.
“Optimizing Portable Product Recycling Through Reverse Supply Chain Technology,” IEEE International Symposium on Electronics and the Environment, May 6-9, 2002, San Francisco, CA, pp. 274-279. https://ieeexplore.ieee. org/document/1003279
“Recycling Portable Electronics,” presented in teleconference to Design for Environment Panel, The Electronics Product Recovery and Recycling (EPR2) Conference and The Electronics Recycling Summit, Arlington, VA, April 17- 19, 2001.
With M. Stutz, I. Nicolaescu, U. Wagner and P. Tzscheutschler, “Energy Use in the Life Cycle of Cellular Phones: A study of the impacts during manufacturing and use.” Joint International Congress and Exhibition, Electronics Goes Green 2000+, September 11-13, 2000, ESTREL Congress Center, Berlin, Germany.
With M. Stutz and M. Zurkirch. “Environmentally Preferred Phone: A Joint Pilot with Swisscom.” European Telecom Network (ETNO) Conference, Ipswich, UK, Nov., 2000.
“The Use of Failure Analysis as a Preventative Quality Tool.” Presented at ASM Materials Week ’92, Chicago, IL, Nov. 2, 1992, and published in Journal of Materials Engineering and Performance, Vol. 2, No. 6, pp.793-797 (Dec., 1993). https://link.springer.com/article/10.1007%2FBF02645679
“Case Studies in Early Component Analysis for Improved Reliability.” Guest speaker, Illiana Section ASQC meeting, Sept, 15, 1992.
“Failure Analysis in Today’s Quality System.” in Transactions of the 46th Annual Quality Congress, May 18-20, 1992, Nashville, TN, pp. 869-875 (Milwaukee, WI: American Society for Quality Control, 1992). http://asq.org/qic/display- item/index.html?item=9908
With C. Bloomer, M. Johnson, S. Kent, B. Mepham, S. Smith, and L. Walker, “Failure Mechanisms in Through-Hole Packages.” Electronic Materials Handbook: Packaging, Volume 1, pp. 969-981 (Metals Park, OH: ASM International, 1990).
“Evaluate Products and Packaging with Drop Tests.” Evaluation Engineering, Oct., 1983, pp. 56-57.